advance product information september 16, 2004 note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 1 5ghz - 9ghz packaged bessel filter product description the tgb2010 bessel filter has low inband return loss, low group delay variation, and a smaller package footprint than competing filters. insertion loss and group delay for each filter matches an ideal 3rd order bessel filter and is matched to 50 ohms eliminating the need for additional components for multiple reflection management. a range of 5 to 9 ghz cutoff frequencies in 1ghz steps are available. the tgb2010 series package size is 2mm x 2mm allowing integration on tightly packed circuit boards. evaluation boards are available. tgb2010-epu-sm key features and performance ? 5, 6, 6.5, 7.5, 8, 9 ghz and thru filters ? < 2.0ps group delay to f o ? typical >15db return loss to f o ? filter bandwidth 0.5 ghz ? package dimensions: 2 x 2 x 0.90 mm primary applications ? high-speed optical networks ? filter networks preliminary measured performance -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 0 2 4 6 8 10 12 frequency (ghz) gain (db) 5 ghz 6 ghz 6.5 ghz 7.5 ghz 9 ghz 8 ghz 0 20 40 60 80 100 0 1 2 3 4 5 6 7 8 9 10 11 frequency (ghz) group delay (ps) 5 ghz 6 ghz 6.5 ghz 7.5 ghz 9 ghz 8 ghz
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 2 table i maximum ratings symbol parameter value notes p in input continuous wave power in-band out-of-band 17 dbm 11 dbm 1 / t assy assembly temperature 260 0 c t stg storage temperature -65 to 150 0 c 1 / these ratings represent the maximum operable values for this device table ii tgb2010-epu-sm rf characterization table (t a = 25 c, nominal) symbol parameter test conditions typical units notes f o 3db bandwidth (ghz) f = 5, 6, 6.5, 7.5, 8, 9 6 0.5 ghz t g group delay variation within 3db bandwidth f = 5 - 9 6 2.0 ps rl 5ghz return loss f = dc - 5 ghz 15 db rl 6ghz return loss f = dc - 6 ghz 15 db rl 6.5ghz return loss f = dc - 6.5 ghz 15 db rl 7.5ghz return loss f = dc - 7.5 ghz 15 db rl 8ghz return loss f = dc - 7 ghz 15 db rl 9ghz return loss f = dc - 7 ghz 15 db note: table ii lists the rf characteristics of typical devices as determined by fixtured measurements.
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 3 measured fixture performance -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 0 2 4 6 8 10 12 frequency (ghz) gain (db) 5 ghz 6 ghz 6.5 ghz 7.5 ghz 8 ghz 9 ghz -30 -25 -20 -15 -10 -5 0 0 1 2 3 4 5 6 7 8 9 10 11 12 frequency (ghz) return loss (db) 5 ghz 6 ghz 6.5 ghz 7.5 ghz 8 ghz 9 ghz
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 4 measured fixture performance 0 20 40 60 80 100 0 1 2 3 4 5 6 7 8 9 10 11 frequency (ghz) group delay (ps) 5 ghz 6 ghz 6.5 ghz 7.5 ghz 8 ghz 9 ghz
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 5 package pinout pin signal 1 nc 2 input 3 nc 4 nc 5 output 6 nc 7 (paddle) ground
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 6 evaluation board input output note: no external components required.
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 7 packaged dimensional drawing tgb2010-epu-sm
advance product information september 16, 2004 tgb2010-epu-sm note: devices designated as epu are typically early in their characterization process prior to finalizing all electrical and process specifications. specifications are subject to change without notice. triquint semiconductor texas phone: (972)994-8465 fax: (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com 8 assembly of a tgb2010-epu surface mount package onto a circuit board solders designated pb-free such as snagcu have reflow temperatures which are higher than those required for sn/pb. typical soldering temperatures are 20 to 30 degrees higher. the molding compound used in this package can withstand 260c peak temperatures. in addition, the molding compound is free of flame retardants defined by some regulations as hazardous. 1. clean the circuit board or module with acetone. rinse with alcohol and di water. allow the circuit to fully dry. 2. to improve the rf performance, we recommend attaching the paddle on the bottom of the package using pb free solder. 3. apply pb free solder to each circuit board pad and to the backside contact for the package. 4. reflow using manufacturer recommended oven and solder profiles. 5. clean the assembly with alcohol. ordering information package part number designations part no package style cutoff frequency tgb2010-00-epu-sm mlf/qfn thru tgb2010-50-epu-sm mlf/qfn 5.0 0.5 ghz TGB2010-60-EPU-SM mlf/qfn 6.0 0.5 ghz tgb2010-65-epu-sm mlf/qfn 6.5 0.5 ghz tgb2010-75-epu-sm mlf/qfn 7.5 0.5 ghz tgb2010-80-epu-sm mlf/qfn 8.0 0.5 ghz tgb2010-90-epu-sm mlf/qfn 9.0 0.5 ghz note: package marked with 2 digit center frequency and manufacturing week only.
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